Kaizen offer services for most of the design stages including production of prototype, NPI reports and if needed transfer to mass production.

Signal Integrity & Design to EMC 

Pre & Post Lay Out simulations of regular & High Speed Boards, contiguously with customer PDR & CDR. Defining BRD: Layer Stuck-up & Traces Impedance, GND & Power Layers. Design BRD to meet EMC standards. Kaizen have the tools, experience and knowledge needed for Multi Drop Buses Signal Integrity.

Backplane Design        

Backplane (BP) interconnects signals between Plug In Units within multi cards system. Signals interconnected via the Backplane are:

• Defining System Connectors, due to System Speed and Signal Density.
• Point to Point (PTP) High Speed (Gbits Ser_Des) from one PIU to another PIU.
• Variable Loaded Buses, interconnecting System PIU assembled into any one of the Backplane Slots, up to fully loaded system.
• Power, 48Volt connected to all PIUs. In that case safety steps must be implemented within the BP Layout.
• Due to the fact that the BP is NON REPLACED PCB,at the customer site, it must be design & manufactured FREE FROM BUGS!

Thermal Analysis

Analysis for Boards and system to predict and ensure suitable temperature, ventilation, and heat distribution.

DFMA DFX

DFF, DFT, DFA, DFM check; automatic testing for manufacturability, assembly and testing of printed circuit boards, in order to detect design problems and prevent potential manufacturing failures.

NPI Support (New Product Introduction) 

Preparation for prototype assembly; full support of pilot run; study of the pilot run, devising and implementing of solutions for the problems discovered.

Product transfer 

Transferring complete product manufacturing process from one location to another.
Fining 2^nd sources to increase production volumes.

Engineering Services 

Constructing BOM trees; component engineering; preparing manufacturing files and assembly instructions.

Design, Redesign & Reverse Engineering

Product Layout design for digital and RF product, Redesign of old product making the needed changes with our DFx tools, reconstruction of obsolete products.

Testability Solutions 

Covering testing types such as ICT; JTAG; Function Test; System Test. Establishing the testing process at early stages of product design, for maximum coverage and reduction of manufacturing costs.

Operational Support 

Manufacturer selection and drawing up the contract with the CM; defining desirable practice methods; selecting and adjusting manufacturing processes; defining logistical tools and processes – all in close referendum with the customer, tailored to meet customer specific needs.

Electronic Design

We design and manufacture Jig and Testers where the UUT (Unit under Test) is being part of the design.
Or Build the product as specified by our customer.
The product can include FPGA , communication, USB , Memory, power converters, Level converters, UART, SGMII and other.

Mechanical Design

We Design Mechanics for the Boards we Design with all the peripheral switches connectors and mechanical fixes.

Power integrity (PI)

Power integrity or PI is an analysis to check whether the desired voltage and current are met from source to destination. Today, power integrity plays a major role in the success and failure of new electronic products. There are several coupled aspects of PI: we can analyze the circuit board and or system (several boards together). Four main issues must be resolved to ensure power integrity at the printed circuit board level:

1. Keep the voltage ripple lower than the specification by controlling the capacitance on the net.
2. Maintaining a proper DC Voltage drop level at the load at high currents.
3. Verify Via current and trace current density under control.